CJET长电科技成立于1972年， 2003年在上交所主板成功上市。历经四十余年发展，CJET长电科技已成为全球知名的集成电路封装测试企业。

CJET长电科技面向全球提供封装设计、产品开发及认证，以及从芯片中测、封装到成品测试及出货的全套专业生产服务。CJET长电科技致力于可持续发展战略，崇尚员工、企业、客户、股东和社会和谐发展，合作共赢之理念，先后被评定为国家重点高新技术企业，中国电子百强企业，集成电路封装技术创新战略联盟理事长单位，中国出口产品质量示范企业等，拥有国内高密度集成电路国家工程实验室、国家级企业技术中心、博士后科研工作站等。

CJET长电科技生产、研发和销售网络已覆盖全球主要半导体市场。

CJET长电科技具有广泛的技术积累和产品解决方案，包括有自主知识产权的Fan-out eWLB、WLCSP、Bump、PoP、fcBGA、SiP、PA等封装技术，另外引线框封装及自主品牌的分立器件也深受客户褒奖。

CJET长电科技以“尊重、包容、进取、求是”的价值观塑造员工，推行“同一个企业，同一个团队，同一个梦想”的和睦大家庭文化，以“不求唯一，争做第一”的服务理念竭尽全力让客户满意。

CJET长电科技——让未来有更好的改变！

Jiangsu Changjiang Electronics Technology Co., Ltd.(JCET) was established in 1972, and in 2003 it was successfully listed on the main board of the Shanghai Stock Exchange. After more than forty years of development, JCET has become the largest IC packaging and testing company in China and the third largest in the world.

The company provides global customers with packaging design, product development and certification, with a full range of services including semiconductor design, wafer probe, bump, packaging, test and drop shipment.

JCET is committed to sustainable development and a win-win philosophy that achieves a harmonious outcome for employees, customers, shareholders and our communities. The company has been rated as a national key high-tech enterprise and is listed in the National Top 10 Electronic Enterprises. Moreover, JCET is leading China’s strategic alliance in the IC packaging and testing industry. JCET is a well-known Chinese brand and has been recognized as a Model Enterprise in China for Quality of Exported Products. The company has a National Engineering Laboratory for high-density IC packaging technology, the only one of its kind, and has a state-level corporate technology center, as well as a post-doctoral research center.

Currently, JCET ranks first place in the world among IC packaging and testing companies in terms of the quantity and quality of the patents issued in China and in the United States.

JCET has an R & D and sales network that supports all the key semiconductor markets globally.

The company has an extensive portfolio of technology and solutions, including the intellectual property (IP) rights of Fan-out embedded Wafer Level Ball Grid Array (eWLB), wafer level chip scale packaging (WLCSP), wafer bump, Package-on-Package (PoP), flip chip Ball Grid Array (fcBGA), System-in-Package (SiP), and other leading technologies. Moreover, our lead frame packaging and the discrete devices have won recognition from multiple customers.

We adhere to the values of “respect, inclusiveness, enterprising and integrity” for our company and our employees. Across the JCET Group of companies, we embrace a harmonious family culture -“We are members of the same company, we are one team, and we have a common dream”. Our service philosophy is “to do our best, striving to be No.1” to achieve customer satisfaction. Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) is working to make our future better!